BH GSO IEC 61188-5-4:2016
IEC 61188-5-4:2007
Bahraini Standard
Current Edition
·
Approved on
08 February 2016
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
BH GSO IEC 61188-5-4:2016 Files
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BH GSO IEC 61188-5-4:2016 Scope
This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
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